Patent for Forming Implants Using Heat Bonding

Taylor & Edelstein obtains patent for client SMed – TA/TD, LLC for forming implants using heat bonding.

These methods for creating orthopedic implants involve a streamlined process to securely attach components. Specifically, a mating part with a designated bonding portion is inserted into an opening in the implant body, which is designed with a variable width. Through a heat bonding process, the bonding portion is fused to the implant body, ensuring a robust connection. This technique allows for precise assembly of the implant components, tailored to meet the structural demands of medical applications.

A key benefit of this approach is the enhanced strength provided by the variable width opening, which creates a mechanical interlock in addition to the heat bond, significantly improving the implant’s durability. Furthermore, the method supports efficient manufacturing, as multiple mating parts and implant bodies can be produced independently and then bonded simultaneously. This enables rapid production of multiple orthopedic implants, optimizing the manufacturing process while maintaining high-quality standards.